r/technology – AMD presents 3D chipset developed jointly with TSMC


AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.

AMD during the virtual event has shown the first application of 3D chiplet technology, a 3D vertical cache bonded to an AMD Ryzen 5000 series processor prototype designed to deliver significant performance gains across a broad set of applications.

AMD claimed its phototype 3D chiplet delivers over 200 times the interconnect density of 2D chiplets and more than 15 times the density compared to existing 3D packaging solutions. Also, through its close collaboration with TSMC, AMD’s 3D chiplet technology consumes less energy than current 3D solutions and is the most flexible active-on-active silicon stacking technology in the world, according to the vendor.

AMD said it is on track to begin production on future high-end computing products with 3D chiplets by the end of 2021.

In addition, AMD disclosed the expanded adoption of its computing and graphics technologies in the automotive and mobile markets with industry leaders Tesla and Samsung. The newly designed infotainment systems in the Tesla Model S and Model X are powered by AMD’s Ryzen embedded APU and RDNA 2 architecture-based GPU that enables AAA gaming. AMD is also partnering with Samsung on its next-generation Exynos SoC, which will feature custom AMD RDNA 2 architecture-based graphics IP that brings raytracing and variable rate shading capabilities to flagship mobile devices.

AMD also introduced its new Ryzen processor offerings for enthusiasts and consumer PCs; leadership data center performance with the latest third-generation AMD EPYC processors; and a full slate of new AMD graphics technologies for gamers.

“At Computex, we highlighted the growing adoption of our high-performance computing and graphics technologies as AMD continues setting the pace of innovation for the industry,” said AMD CEO Lisa Su.

“With the launches of our new Ryzen and Radeon processors and the first wave of AMD Advantage notebooks, we continue expanding the ecosystem of leadership AMD products and technologies for gamers and enthusiasts. The next frontier of innovation in our industry is taking chip design into the third dimension. Our first application of 3D chiplet technology at Computex demonstrates our commitment to continue pushing the envelope in high-performance computing to significantly enhance user experiences.”


AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.

AMD during the virtual event has shown the first application of 3D chiplet technology, a 3D vertical cache bonded to an AMD Ryzen 5000 series processor prototype designed to deliver significant performance gains across a broad set of applications.

AMD claimed its phototype 3D chiplet delivers over 200 times the interconnect density of 2D chiplets and more than 15 times the density compared to existing 3D packaging solutions. Also, through its close collaboration with TSMC, AMD’s 3D chiplet technology consumes less energy than current 3D solutions and is the most flexible active-on-active silicon stacking technology in the world, according to the vendor.

AMD said it is on track to begin production on future high-end computing products with 3D chiplets by the end of 2021.

In addition, AMD disclosed the expanded adoption of its computing and graphics technologies in the automotive and mobile markets with industry leaders Tesla and Samsung. The newly designed infotainment systems in the Tesla Model S and Model X are powered by AMD’s Ryzen embedded APU and RDNA 2 architecture-based GPU that enables AAA gaming. AMD is also partnering with Samsung on its next-generation Exynos SoC, which will feature custom AMD RDNA 2 architecture-based graphics IP that brings raytracing and variable rate shading capabilities to flagship mobile devices.

AMD also introduced its new Ryzen processor offerings for enthusiasts and consumer PCs; leadership data center performance with the latest third-generation AMD EPYC processors; and a full slate of new AMD graphics technologies for gamers.

“At Computex, we highlighted the growing adoption of our high-performance computing and graphics technologies as AMD continues setting the pace of innovation for the industry,” said AMD CEO Lisa Su.

“With the launches of our new Ryzen and Radeon processors and the first wave of AMD Advantage notebooks, we continue expanding the ecosystem of leadership AMD products and technologies for gamers and enthusiasts. The next frontier of innovation in our industry is taking chip design into the third dimension. Our first application of 3D chiplet technology at Computex demonstrates our commitment to continue pushing the envelope in high-performance computing to significantly enhance user experiences.”

Leave a Comment

Your email address will not be published. Required fields are marked *